CATEGORY
Heat resistance label
Description
PI die-cut 200~220℃
TEFLON die-cut 260℃↑
Application：For electronic components.
|
Carrier |
Carrier thick. |
Adhesive |
Temperature ℃ |
Color |
PTFE film |
|
Polyimide |
0.025mm |
Silicone |
200 |
Amber |
Yes |
|
TEFLON |
0.13mm |
Silicone |
260 |
Brown |
Yes |
PI die-cut 200~220℃TEFLON die-cut 260℃↑